Device-Enabled Next-Generation Power Grids: Wireless Power Transfer, Optoelectronics, and Power Electronics for Grid-Interactive Applications

With the accelerating deployment of renewable energy, electrified transportation, distributed energy resources (DERs), and ubiquitous sensing, future power grids are evolving into cyber-physical energy systems that demand finer-grained observability, controllability, and resilience. Beyond market and system-level coordination, device-level innovations—including wireless power transfer (WPT), advanced power electronic interfaces, and optoelectronic sensing/communication hardware—are becoming key enablers for scalable grid flexibility, safe electrification, and real-time grid awareness. This session focuses on the application, integration, and system-level impact of electronic devices and enabling technologies (e.g., WPT systems, optoelectronic devices, power converters, sensing and communication modules) in the emerging smart grid. The goal is to connect device design with grid services and operational value, enabling practical deployments across distribution networks, microgrids, EV infrastructure, industrial electrification, and energy internet ecosystems. Topics of interest include, but are not limited to:

1. Grid-interactive electronic devices and architectures for next-generation distribution networks.

2. Wireless power transfer  (static/dynamic) for EVs, UAVs, AGVs, robotics, and smart infrastructure.

3. Bidirectional charging interfaces (V2G/V2X) and converter designs enabling grid services.

4. Optoelectronic sensing for grid monitoring (fiber-optic sensors, optical current/voltage sensing, partial discharge detection).

5. Photonic/optical communication links and synchronization for grid protection, control, and wide-area monitoring.

6. Power electronic transformers, solid-state substations, and advanced converter topologies for grid modernization.

7. Converter control for grid support: grid-forming/grid-following, inertia emulation, voltage/frequency regulation.

8. Device-to-system co-design: electromagnetic/thermal/mechanical reliability, EMC/EMI, safety, and protection coordination.

9. Data-driven diagnostics and prognostics enabled by embedded sensors and edge electronics.

10. Standards, interoperability, and cybersecurity considerations for device-enabled grid integration.

11. Demonstrations, pilot projects, and case studies: field deployment results and techno-economic evaluation.

Chairs:

Wang Heshou, The Hong Kong Polytechnic University, China

Heshou Wang received his M.Sc. degree and Ph.D. degree in Electrical Engineering from The Hong Kong Polytechnic University, Hong Kong, in 2018 and 2022, respectively. From 2018 to 2019, he was a research assistant at the Department of Electrical Engineering, The Hong Kong Polytechnic University, where he is currently a postdoctoral fellow. His main research interests include applied electromagnetics, wireless power transfer, and electric vehicles.

Co-chair：

Lei Xueqin, City University of Hong Kong, China

Xueqin Lei was born in Zhejiang Province, China. She received the doctoral degree in electromagnetic field and microwave technology from Xiamen University, Xiamen, China. She is currently a researcher at the City University of Hong Kong. Her research interests include optical fiber interferometric sensor designing, fabricating, theoretical studying, and application in marine and industry.